Customized chamber furnaces designed for your specific thermal processes, featuring high temperature uniformity and precise control accuracy.
Our chamber furnaces are versatile high-temperature solutions designed for a wide range of industrial and laboratory applications. They feature a spacious heating chamber with excellent temperature uniformity, making them ideal for processes such as heat treatment, annealing, sintering, and material testing. With customizable dimensions, temperature ranges, and atmosphere control options, our chamber furnaces can be tailored to meet the specific needs of your application.
1200℃ Electric Top-opening Box-type Furnace, Heating by Resistance Wires on Both Sides + Bottom, Furnace Door Lifting Controlled by Handle Switch, Temperature Control ±1℃, Three-layer Insulation with Over 80% Energy Saving, Suitable for Industrial Batch High-temperature Sintering of Materials, Easy to Operate.
Heat-storage Furnace Bottom + Reinforced Furnace Top improve temperature field uniformity, suitable for sintering experiments of special ceramics such as Jun Porcelain and Ru Porcelain, featuring high precision and reliability.
Integrated High-temperature Furnace, 1000×1000×1000mm Large Furnace Chamber, 380V/80KW Power Supply, Silicon Carbide Rod Heating on Both Sides, Temperature Control ±1℃, Air-cooled Double-layer Furnace Body + 360° Rotatable Furnace Door.
1200℃ Box-type High-temperature Furnace: 300×200×200mm Chamber, 380V/8KW, SiC Rod Heating (Both Sides), ±1℃ Temp Control & Uniformity, Air-cooled Double-layer Body (Shell Temp ＜45℃), 30-segment Program Temp Control + RS485, Suitable for R&D Experiments & Small-batch Sintering.
1700°C atmosphere box-type high-temperature furnace with dual-circuit protection and imported gas path valves. It can store multiple process curves and export data, suitable for high-precision atmosphere heat treatment in research institutes and enterprise laboratories.
1000°C hot-air stirring box-type high-temperature furnace with adjustable heating rate from 0.1 to 15°C/min, three-layer insulation for energy saving, dual-circuit protection, and support for storing multiple process curves and exporting data.
